As device scaling and the economics of semiconductor manufacturing reach major inflection points, developing SOCs that achieve the performance needed for future mobile computing devices while delivering on the holy grail of “always on” fantastic resolution displays requires the next level of deep collaboration across the entire ecosystem. This reality has put an increased strain on device and components manufacturers to bring PC-like performance to the latest mobile devices. As we look to 2013, smartphones and tablets sales are only expected to increase, making up 40% of the global consumer electronics market’s yearly sales.
To enable true mobile computing at the component level, Samsung Foundry has been hard at work on process and design innovation in our most advanced logic fabs, enabling customers to manufacture the latest chips used in the newest electronic devices. Last month, we announced our most recent advancement in process technology in collaboration with our ecosystem partners ARM, Cadence, Mentor and Synopsys: 14nm FinFET.
14nm FinFET allows Samsung to manufacture customers’ chips with an innovative design infrastructure that brings significant gains in performance alongside low-power consumption for mobile devices. We’ll be discussing our newest advancements in process node technology and the need for greater collaboration among foundries, ecosystem partners and customers at Common Platform Technology Forum on February 5 at the Santa Clara Convention Center. IBM, Samsung and GLOBALFROUNDRIES will be co-hosting the event as part of the Common Platform Alliance.
Join us at the forum for:
What do you think will help drive further collaboration in the semiconductor industry? I’d love to hear your thoughts in the comments section below.
Tags: 14nm, 14nm FinFet, Advanced Foundry Technology, Common Platform, Common Platform Technology Forum, Samsung, Samsung Electronics, Samsung Foundry