A Tribute to Excellence

Every year, Samsung Semiconductor is recognized by many – publicly and privately, for outstanding products, service and customer-partner solutions.  One of the most meaningful acknowledgments comes in the form of Innovation Awards from the Consumer Technology Association as part of its annual Consumer Electronics Show, which recognizes outstanding design and engineering in consumer-focused technology products.

CES Innovation Awards

For the 2016 CES Innovation awards, at which Samsung Electronics walked away with many honors, Samsung Semiconductor entered four premier products and came away with two Honorees:  our 128GB UFS package and our 12Gb LPDDR4 mobile DRAM chip.  We’re honored to be recognized by such a prestigious organization, if for no other reason than the awards point to the prominence of Samsung memory technology in the marketplace, and our continuous commitment to innovation.

Our ultra-fast 128GB Universal Flash Storage package is the highest capacity, highest performing and smallest embedded storage memory for mobile devices.  With the massive proliferation of multimedia content, this new technology allows for quick access to photos taken by 20MP+ cameras and to 4K video files, while further helping to pave the way for 5G connectivity.

Our 12Gb LPDDR4, which is the world’s highest density mobile DRAM chip, allows OEMs to design packages up to 6GB, delivering bandwidth three times faster than the industry’s previous highest performing mobile DRAM solution.  This new chip is designed to accommodate the real-time multitasking scenarios of today’s UHD-resolution flagship smartphones and tablets, while providing 50% greater power efficiency.

Research, Development & Service

Of course, there are quite a few people involved in the making of award-winning products. My hat is off to the memory researchers and developers here and at our parent company – Samsung Electronics, who keep us on the leading edge of innovation year in and year out.  I also take a bow to our product planning, marketing and sales teams for providing the kind of support that helps to make these products real winners in every which way.  We’re head and shoulders above the competition when it comes to not only detecting the needs of the marketplace but also in delivering solutions that offer more efficient investment with the most advanced technology and memory products.

For example, we started mass producing the industry’s first 3D TSV-based  DDR4 modules for enterprise servers, the industry’s first 3D TSV-based 128GB DDR4 modules for the enterprise, and the industry first 256-gigabit 3D V-NAND SSDs for data centers, storage arrays and client PCs.  And, it’s not all just about technology leadership.  A case in point:  just a few months ago, one major customer – Cisco – selected us for its top 2015 Excellence in Service and Responsiveness award, underscoring the importance of providing great support in addition to innovative products and technologies.

Customer Collaboration

Perhaps the greatest recognition of Samsung innovation and overall product value comes when customers repeatedly select our solutions for important new market offerings.  For example, in recent months we have seen Dell choose our TLC V-NAND SATA and SAS technology for leading-edge Dell Compellent and PowerEdge server systems, while HP has just chosen our M.2 NVMe SSD for the new HP Z Turbo Drive Quad Pro that is featured in their Z Workstations.  Further, Lenovo is using some of the latest Samsung SSD technology in its mobile and desktop workstations, including the Lenovo P50, P70 and P700 (and the just announced P310).

Embracing the best in memory, storage and other components, our customers are doing a tremendous job in orchestrating the finest in OEM ingenuity as they breathe new life into each of the major markets.  We’re only too glad to help.  With ongoing customer collaboration, fully integrated operations and an unyielding commitment to innovation, watch as we continue to carve new pathways for growth in a new era – the era of enhanced device connectivity.