Making a Big Impression at Flash Memory Summit 2015

Samsung Semiconductor will have a large presence at Flash Memory Summit 2015. In addition to being a Premier sponsor, we will deliver a keynote and several breakout talks as well as showcase many of our key memory technologies in a 880-square foot booth – one of the largest at the show.

The keynote, to be presented by myself and Bob Brennan, Senior Vice President of the Memory Solutions Lab at Samsung Semiconductor, is entitled “Memory Technology Advances Shape a New Era in Flash Innovation.” It will be given on Tuesday, Aug. 11 at noon in the Mission City Ballroom of the Santa Clara (CA) Convention Center.

The innovation focus of our keynote covers a wide breadth of areas, including how Flash is being developed and employed in smarter and smarter ways. Of particular interest will be our efforts to improve stacking efficiency, reduce power consumption, grow capacities and increase performance.

We will highlight the tremendous advances that have been made with solid state drives (SSDs) over the past year, especially with the use of 3D V-NAND and the increasingly widespread adoption of triple-level-cell and NVMe technologies. In further harnessing NAND’s full potential, we will discuss progress in readying solid state drives to perform workload management and bringing higher bandwidth to all-flash arrays.

We are in an age of massive storage: this means instant connectivity, instant data access and instant relevance for electronic information sharing.   Watch as data centers with flash-optimized storage embrace greater use of real-time analysis and better position themselves as the market moves closer to the Internet of Things.

Beyond our keynote, Samsung Semiconductor Inc. also will be delivering five 20-minute breakout presentations.  They are:

1)     3D TLC is the new MLC for NAND

Tien Shiah, SSD product marketing manager

Tues.  Aug. 11 (our presentation sometime between 3:15 – 4:25 p.m. in Forum M-12)

(Tien will also lead a panel discussion (Forum C-31) focused on SSDs in the Enterprise from 8:30 – 10:50 a.m. Thursday, Aug. 13)


2)     Why NVMe Will Replace SATA SSDs in the Data Center

Michael Smullen, SSD product marketing manager

Thurs., Aug. 13 (our presentation sometime between 3:10-4:25 p.m. in Forum D-11 as part of Session 303-1)


3)     Universal Flash Storage Enables Endless Opportunities for Flash

David Ghodsizadeh, NAND flash product management

Tues., Aug 11 (our presentation sometime between 8:30 – 9:35 a.m. as part of Session 101-C)


4)     Interest in PCIe SSDs expected to Soar with the Next CPU Chipset

Anders Graham, SSD product marketing manager

Tues., Aug. 11 (our presentation sometime between 3:15 -4:25 p.m. in Forum C-12)


5)    In-Storage Computing: Ultimate Solution for Accelerating I/O Intensive Applications

Yangseok Ki, director, Samsung Semiconductor

Thurs., Aug. 13 (our presentation sometime between 8:30-9:35 a.m. as part of Session 301-D)


As you can see, we will be covering a lot of ground. I encourage you to attend any or all of the aforementioned sessions and to stop by our booth (# 307) to hear about soon-to-be launched leading-edge solutions and latest R&D advancements.

In the Samsung booth, we will have a provocative slate of demos that allows attendees to see firsthand what we are emphasizing now and later this year in the marketplace.  These include improved 3D V-NAND performance, more cost-efficient, high speed V-NAND SSDs, the fastest network storage in the industry; the highest capacity SSDs, a performance versus power consumption analysis for data center storage and high capacity SSDs for the consumer aftermarket.

My team is looking forward to seeing you at the summit.