Addressing IOT with a New Chip Solution: 802:11BGN

One of the hot topics this year at CES and MWC is what’s been coined the Internet of Things (IoT) which is the ability to connect with billions of devices and appliances wirelessly where they can be programmed and controlled. For consumers this includes things like small appliances, home automation and audio, and lights and switches. As we move away from the PC era and embrace more smart technology driven by smartphones and tablets, developers are focusing on what most likely will be the next era of computing.

Pioneering new technology faces challenges, and success is achieved through problem solving and innovation. The challenge today is that in order for these consumer applications to connect to the Internet, they need to be small, inexpensive and low power. Therefor their components need to be extremely efficient.

Samsung’s System LSI business enables OEM manufacturers the ability to integrate advanced RF functionality into their designs, making connectivity applications possible. In fact our latest 802.11bgn single chip solution addresses the very needs of IoT devices. The combination of its extremely small footprint and features and power management integration, provides enhanced performance and flexibility to designers.

I invite you to watch our latest episode of Samsung Semiconductor TV as Justin Ging discusses the benefits of our new 802.11bgn chip design. As always, I’m interested in hearing from you. Please share you questions and feedback in the comments section below.