Foundry

The Life’s Fab blog delves into all topics pertaining to advanced process technologies, advanced packaging solutions, design enablement and IP, as well as high-volume manufacturing. This blog looks at the challenges, investments, technology, and engineering topics surrounding foundry services, which have become essential criteria to the consumer and IT electronics industry.

Consumer-Driven Innovation in Next-Generation SoC Designs

When I take a step back and examine technology trends in consumer electronics, it seems clear that the future direction of system-on-chip design points to the growing importance of IP and software. …

Collaboration – A Critical Link to Successful 32nm ASIC Designs

The successful tape-out of a new chip design is always something to celebrate.  It’s the culmination of months of intensive teamwork, late nights, lots of caffeine and more conference calls than can…

What to Expect at 20nm

Do you have plans to start a 20nm design in 2011? If so, please leave a comment below with your thoughts. According to Moore’s Law, the density of a chip will double…

Common Platform Tech Forum – It’s a Wrap

On Tuesday, Jan 18, 2011, I had the privilege of emceeing the keynote sessions at this year’s Common Platform Technology Forum, hosted by my colleagues at Samsung, IBM and GLOBALFOUNDRIES. From my…

Common Platform Tech Forum – It's a Wrap

On Tuesday, Jan 18, 2011, I had the privilege of emceeing the keynote sessions at this year’s Common Platform Technology Forum, hosted by my colleagues at Samsung, IBM and GLOBALFOUNDRIES. From my…

True Collaboration – Common Platform Technology Forum

Welcome to my first blog post for Voices @ Samsung Semiconductor.  The foundry section of this site is called “Life’s Fab” and I have to agree.   The semiconductor contract manufacturing sector is…