Tape Outs at 32nm & 28nm Foretell a Bright Future At These Advanced Nodes

Samsung began its foundry business over six years ago with a focus on advanced technology nodes.  With an aggressive process technology roadmap in place, we set out to compete in an industry that was already seeing some consolidation. Leveraging our core competencies in volume manufacturing and deep sub-micron expertise, Samsung’s foundry business has become a key player in just a short number of years

As of last year, 45nm became the majority volume runner in our 300mm S Line in Giheung. The ramp to production went very smoothly thanks to our vast experience with immersion lithography and robust technology. The yield on this node has been excellent and we continue to drive improvements. Hand held devices powered by 45nm low power SoCs manufactured at Samsung for our customers are ubiquitous in the market today.

Last year, we announced a new logic fab at our Austin, TX facility. Currently, that line is on schedule with 45nm low-power process qualified and the expectation is that this fab will be producing about 40,000 wafers per month by the end of 2011. 

Our 32nm LP High-k Metal Gate (HKMG) process node is also fully qualified with best-in-class yields and silicon proven design flows that are extendible to 28nm LP. Samsung’s ASIC Design Center also has a successful track record with design tape-outs at 32nm. See my recent post titled “Collaboration – A Critical Link to Successful 32nm ASIC Designs.” As of today, we have received 35 tape outs from our customers at 32nm and 28nm and many more are in the pipeline for tape out this year. Customers are anxious to capitalize on the benefits of HKMG higher performance with lower power consumption.

Building a services-related business takes an extreme amount of care and focus. With superior technology, unmatched manufacturing and strong financial backing, Samsung’s foundry business will be one of the few players to stretch down the process technology curve and is committed to meet customers’ design and manufacturing requirements.