True Collaboration – Common Platform Technology Forum

Welcome to my first blog post for Voices @ Samsung Semiconductor.  The foundry section of this site is called “Life’s Fab” and I have to agree.  

The semiconductor contract manufacturing sector is currently outpacing the rest of the semiconductor industry, which is “fab” news for Samsung’s Foundry business.  Toshiba’s recent decision to outsource its advanced process logic wafer manufacturing to Samsung Foundry illustrates the continuing trend of semiconductor companies moving to a fabless (or fab-lite) business model.

This trend needs to be supported on the foundry side by a collaborative ecosystem of business partners from the manufacturing facility to the design flow and physical IP to the testing and packaging.  Over the past five years, Samsung Foundry has been involved with one of the most unique collaborative ventures ever seen in the semiconductor industry – the Common Platform. This alliance has joined Samsung, IBM, and GLOBALFOUNDRIES to bring the most advanced, fully-qualified process technologies to its foundry customers, including 32nm LP High-K Metal Gate process node at Samsung’s S Line in Giheung, Korea.

On January 18, 2011, the Common Platform alliance will host its technology conference at the Santa Clara Convention Center in Silicon Valley. During the conference, I will join my colleagues from Samsung, IBM, and GLOBALFOUNDRIES to share information on 32/28nm High K Metal Gate manufacturability, details on 20nm  and beyond, in addition to providing  updates on our design  enablement ecosystem and overall manufacturing capabilities. For a sneak peek, check out my interview with EDACafé’s Graham Bell below:  

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Will you be attending? If so, feel free to post a comment below on what you’re hoping to learn during the conference. Looking forward to seeing you there!